NXP, the independent semiconductor company founded by Philips, and STMicroelectronics, an electronics and semiconductor manufacturer, has closed the deal bringing together key wireless operations of both companies into ST-NXP Wireless, a deal announced in April this year.
According to the companies, ST-NXP Wireless will combine key design, sales and marketing, and back-end manufacturing assets from both parent companies into a streamlined organisation. The company is designed with low capital intensity, securing leading-edge wafer manufacturing capacity from both parent companies and foundries, while operating its own assembly and test facilities.
“Semiconductor companies are coming to play an ever more important role, contributing an ever larger share of the product value chain to handset makers, who expect us to deliver leading-edge solutions across the full spectrum of mobile applications. ST-NXP Wireless is being created to address this new paradigm,” said Alain Dutheil, Chief Executive Officer of ST-NXP Wireless.
To be incorporated in Switzerland and headquartered in Geneva, ST-NXP Wireless will have in excess of 7,500 employees with major facilities in Belgium, China, Finland, France, Germany, India, Italy, Malaysia, Morocco, the Netherlands, Philippines, Singapore, Sweden, Switzerland, UK and the USA.
The joint venture will start operations on the first week of August.